2/25/2026

What is DFT in VLSI ? | DFT- Ep-1




What is DFT ?



Abriviation of Design for Testability. A set of design techniques that make ICs more testable after manufacturing. Since testing each functionality manually is impractical,  DFT ensures that defects can be efficiently detected, diagnosed using ATE.

Challenges in Testability of Digital Circuits :

For  Combinational Logic, testability decreases with increasing logic levels, whereas Sequential Circuits are  harder to test due to multiple internal states.

Why is DFT important?

DFT is crucial to - 

i. detect manufacturing defects (shorts, opens, stuck-at faults)

ii . to reduce the cost and time of post-silicon testing

iii. to ensure high yield and reliability of chips in production.

iv. to enable in-system diagnostics (like built-in self-test/BIST)


Common DFT Techniques :


i. Scan Insertion / Scan Chains : Converts flip-flops into a shift-register structure, increase controllability and observability, Enables automatic generation of test patterns (ATPG – Automatic Test Pattern Generation).

ii. Boundary Scan (IEEE 1149.1 / JTAG) :  Adds test circuitry to I/O pads for board-level testing and debugging. Common in SoCs and PCBs.

iii. Built-In Self-Test (BIST) :  Circuit tests itself using internally generated patterns and response checking.  Includes LBIST i.e. Logic BIST, MBIST Memory BIST

iv. Memory BIST (MBIST) : Specifically targets SRAM/DRAM/Flash testing inside the chip. Applies march tests or algorithms to detect memory faults.

v. Compresses test patterns and decompresses them on-chip to reduce test time and memory usage

vi. Test Compression : Compresses test patterns and decompresses them on-chip to reduce test time and memory usage

vii. Fault Simulation and ATPG : Software tools simulate faults and generate efficient test vectors


DFT Approaches : 

1. Ad Hoc Approach

2. Structured Approach


DFT : Ad-hoc Approach

What is Ad-hoc approach ?

Non-systematic manual methods used in the early stages of test design, served as an early method to improve testability. This approach is limited in scalability, predictability, and automation. This limitation led to the development of structured DFT techniques.

Key Characteristics of Ad-hoc DFT:

i. Local Modifications: Involves small, manual changes to specific parts of the circuit to enhance testability. Examples: adding test points, simplifying logic, breaking feedback loops.

ii. Non-Systematic: There is no formal or repeatable process. Every design requires a different ad-hoc strategy, often reinventing solutions.

iii. Unpredictable Results: Improvement in testability is not guaranteed or consistent. Effectiveness varies from design to design.

iv. Not Easily Automatable: Because of its manual and unstructured nature, it cannot be automated by EDA tools.

v. Difficult to Budget and Plan: Hard to estimate time, cost, or resources required to implement DFT using ad-hoc methods.


Limitations :

Poor scalability. Doesn’t work well for complex and large designs. Requires expert knowledge and deep understanding of the circuit. Difficult to maintain or reuse in future designs.

Test Point Insertion:

A widely used ad hoc DFT technique , improves controllability and observability of internal circuit  node.

Process : 

Low controllability/observability nodes are identified by Testability analysis. Test points are inserted at these nodes in the form of:

1. Observation Points (OPs) – to improve observability.

2. Control Points (CPs) – to improve controllability.

Observation Point (OP) Insertion:



Above figure illustrates a circuit. With 3 low-observability nodes - Observation points composed of a MUX and a D flip flop . Low observability node is connected to the 0 port of the MUX. All OPs are serially connected to form a shift register. SE signal is used for MUX post selection.

i. When SE = 1 and CK =1 : the logic values of the low-observability nodes are captured into the D-FFS

ii. When SE= 1 , OP1 , OP2 ,OP3 operate as a shift registers

Captured logic values can be observed through OP_output during sequential clock cycles. Observability of the circuit nodes is greatly improved.


Control Point Insertion:



Above figure illustrates a circuit with 3 low-controllability nodes. 

Structure of Control Point: Composed of a MUX and a D flip-flop. The original node connection is replaced by inserting a MUX between source and destination to increase controllability of the point.

Operation:

i. Normal mode : Test Mode = 0. Source drives destination via MUX port 0.

ii. Test mode : Test Mode =1, Value from the D FF drives destination via MUX port 1.

Outcome: Controllability is greatly enhanced.

Caution:  Avoid inserting CPs on critical paths to prevent extra delay.

Preferred Practice :

Instead of a CP alone, consider a scan point (combination of CP + OP). This allows observing the source end as well as controlling the destination.

Test point sharing:

Multiple nodes can share a test point using XOR gate networks to merge low-observability nodes. This can reduce area overhead but might increase routing complexity.


DFT :  Structured DFT


Structured Design-for-Testability (DFT) aims to improve circuit testability through a methodical, test-oriented design methodology, yielding more predictable results. Scan Design is the most widely used structured DFT technique. Improves controllability and observability of storage elements in sequential circuits.  Achieved by converting a sequential design into a scan design with three modes of operation:




1. Normal Mode : All test signals are off; the circuit works in its functional configuration.

2. Shift Mode : Used to shift test data into and out of scan cells.

3. Capture Mode : Used to capture test responses after applying test stimuli.

Role of Test Mode Signal (TM) :

In Shift and Capture modes, the TM signal enables all test-related features. It simplifies testing, debugging, and fault diagnosis, improves fault coverage, Ensures safe circuit operation during tests. Circuit modes and operations are managed through extra test signals or test clocks.

Sequential Circuit Testing and Scan Design :

Testing sequential circuit is difficult. Sequential circuit has to low controllability and observability of internal states.Scan design provides external access to selected storage elements 

- Selected storage element is converted into scan cells

- Scan cells are connected as scan chains (shift registers)

- In shift mode, test data is shifted in and responses are shifted out in n clock cycles.

- Direct access to storage elements simplifies test generation and speeds up fault detection.


SCAN CELL DESIGN:



A scan cell typically has two selectable inputs:

i. Data Input (DI): Receives signals from the circuit’s

combinational logic.

ii. Scan Input (SI): Receives signals from the output of

another scan cell to form one or more scan chains.

Converting Normal Flop into Scan Flop:

- A normal D-FF is converted in to a scan flop

- SCAN input is multiplex before putting into scan chain

- Scan enable is used to control which input will

propagate to output

Formation of Scan Chains :


- Scan cells are linked in sequence

- First scan cell’s scan I/P is connected to a primary I/P

- Last scan cell’s O/P is connected to a primary O/P

Selection Mechanism for Modes :

- Normal/Capture Mode: Data input is selected to update the output.

- Shift Mode: Scan input is selected to update the output.

Various Scan Cell Design :

1. Muxed-D Scan

2. Clocked-Scan

3. Level-Sensitive Scan Design (LSSD)

1. MUXED D-SCAN CELL:




i. Edge- triggered muxed-D scan cell design :

 This scan cell is composed of a D flip-flop and a multiplexer.   The multiplexer uses a scan enable (SE) input to select between the data input (DI) and the scan input (SI). In normal/capture mode, SE is set to 0. The value present at the data input DI is captured into the internal D flip-flop when a rising clock edge is applied. In shift mode, SE is set to 1. The SI is now used to shift in new data to the D flip-flop while the content of the D flip-flop is being shifted out.




ii. Level-sensitive/edge-triggered muxed-D scan cell design :

This scan cell is composed of a multiplexer, a D latch, and a D flip-flop. The multiplexer uses a scan enable input SE to select between the DI and SI. Shift operation is conducted in an edge-triggered manner . Normal and capture operation are conducted in a level-sensitive manner. Major advantages of using muxed-D scan cells are their compatibility to modern designs. The disadvantage is that each muxed-D scan cell adds a multiplexer delay to the functional path.

2. CLOCKED SCAN CELL : 




An edge-triggered clocked-scan cell can also be used to replace a D flip-flop in a scan design. A clocked-scan cell also has a data input DI and a scan input SI . In the clocked-scan cell, input selection is conducted using two independent clocks, data clock DCK and shift clock SCK .

Normal/capture mode : The data clock DCK is used to capture the value present at the data input DI into the clocked-scan cell.
Shift Mode : The shift clock SCK is used to shift in new data from the scan input SI into the clocked-scan cell, while the current content of the clocked- scan cell is being shifted out.

The major advantage of using a clocked-scan cell is that it results in no performance degradation on the data input.
The major disadvantage, however, is that it requires additional shift clock routing.

3. LSSD SCAN CELL DESIGN:




LSSD scan cell is used for level-sensitive, latch-based design.
Above figure shows a polarity-hold shift register latch (SRL) design, that can be used as an LSSD scan cell.





This scan cell contains two latches, a master two-port D latch L1 and a slave D latch L2 . Clocks C, A, and B are used to select between the data input D and the scan input I to drive L1 and L2 . In an LSSD design, either L1 or L2 can be used to drive the combinational logic of the design.
In order to guarantee race-free operation, clocks A, B, and C are applied in a non-overlapping manner.
In designs where +L1 is used to drive the combinational logic, the master latch L1 uses the system clock C to latch system data from the data input D and to output this data onto +L1.
In designs where +L2 is used to drive the combinational logic, clock B is used after clock A to latch the system data from latch L1 and to output this data onto +L2.
Capture mode uses both clocks C and B to output system data onto L2 . The major advantage of using an LSSD scan cell is that it allows us to insert scan into a latch-based design. In addition, designs using LSSD are guaranteed to be race-free, which is not the case for muxed-D scan and clocked-scan designs. The major disadvantage, however, is that the
technique requires routing for the additional clocks, which increases routing complexity.


Watch the video lecture here:





2/23/2026

๐ŸŽ™️ India’s ๐Ÿ‡ฎ๐Ÿ‡ณ Semiconductor Manufacturing Moment | Guest - Parikshit Sengupta



In our latest episode of The Semiconductor Podcast, we sit down with Parikshit Sengupta, Segment Head – Materials & Semiconductor at HORIBA India, to explore India’s evolving semiconductor manufacturing journey.

๐Ÿ” From his personal journey into semiconductors to a deep, yet accessible discussion on:
๐Ÿงช Materials, characterization & process control ๐Ÿญ What a full-grown semiconductor manufacturing ecosystem really looks like ๐ŸŒ How India’s trajectory compares with the West and the East ๐Ÿ“Š The role of long-term policy continuity in shaping semiconductors ๐ŸŽ“ Academia–industry collaboration & skill development ๐Ÿ‘ฉ‍๐Ÿ”ง And most importantly — practical guidance for freshers aspiring to enter semiconductor manufacturing This episode is a must-watch for students, engineers, professionals, and ecosystem builders who want to understand where India stands today and what lies ahead in the next decade. In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape. Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area. Guest : Pariskshit Sengupta Parikshit Sengupta is a seasoned semiconductor and scientific business leader with close to two decades of experience managing end-to-end operations across sales, service, manufacturing, applications, new product development, and business strategy. Currently serving as Segment Head – Materials & Semiconductor at HORIBA India, he has played a pivotal role in expanding the company’s semiconductor business across India and export markets, including successfully building the Export Division from the ground up. Known for his performance-driven mindset and collaborative leadership style, Parikshit consistently translates organizational goals into measurable outcomes. His expertise spans consultative and direct sales, new business development, distributor and account management, marketing, P&L ownership, and team leadership, making him a respected voice in India’s evolving semiconductor manufacturing and scientific instrumentation ecosystem.

Watch the episode here:





2/15/2026

๐ŸŽ™️ Semiconductor Leadership Journey: From Engineer to Global Product Head | Guest: Naveen Muddu Krishna

 



We’re delighted to welcome Naveen Muddu Krishna , Director of Product Engineering, SanDisk to The Semiconductor Podcast for a deeply insightful and heartfelt conversation.

With over 22 years in the semiconductor industry, his journey is one that truly resonates—from hands-on engineering in digital, analog, and system design to leading large global teams across India, the US, South Korea, and Israel. In this episode, he speaks candidly about growth, responsibility, leadership, and the realities of building world-class products at scale.

๐Ÿ” What we explored in this episode:


• ๐ŸŒฑ His early career journey and lessons that shaped him as an engineer and leader
• ๐Ÿ”„ Transitioning from technical contributor to global engineering leadership
• ๐ŸŒ Leading diverse teams across geographies with trust and alignment
• ๐Ÿง  Thinking at the system level across networking, embedded, video, healthcare, storage & defense
• ๐Ÿญ Bridging the gap between design intent and manufacturing reality
• ๐Ÿค– How AI, automation, and Industry 4.0 are reshaping engineering work
• ⚖️ Where human judgment, accountability, and ownership still matter most
• ๐Ÿ‡ฎ๐Ÿ‡ณ India’s evolving role in ESDM, GCCs, and global product ownership
• ๐ŸŽ“ Closing the gap between industry and academia
• ๐Ÿ’ฌ Honest advice for Gen Z engineers navigating their careers

๐ŸŽง This episode is reflective, practical, and inspiring—especially for engineers, leaders, and anyone building long-term impact in deep tech.

▶️ Watch the episode here : 




2/07/2026

๐ŸŽ™️Quantum Computing, EDA, AI & Semiconductors: The Future of Deep Tech | Guest - Prof. Amlan Chakrabarti



We’re excited to announce a brand-new episode featuring Prof. Amlan Chakrabarti—a pioneer in quantum computing and a leading voice in VLSI, EDA, AI, and advanced computing.

In this episode, we explore his remarkable journey from hands-on EDA engineering to starting quantum computing research nearly two decades ago, well before it became mainstream. From developing early computational tools for quantum research to now looking at collaborations on qubit fabrication, the conversation truly spans the full stack—from design to devices. ๐Ÿ” What we discussed in today’s episode: • ๐Ÿงฉ His early career in EDA (OrCAD, VHDL) and how it shaped his research mindset • ⚛️ Why he chose quantum computing when it was still a niche field • ๐Ÿ› ️ Key bottlenecks in quantum tech: hardware, CAD tools & algorithms • ๐Ÿ”‹ The role of reversible logic & ultra-low-power computing in future chips • ๐Ÿ“ Gaps between academic EDA research and industry-ready tools • ๐Ÿ” Where FPGAs and reconfigurable platforms fit in the next decade • ๐Ÿค– How AI is becoming deeply embedded into chips and real-world systems • ๐Ÿ‡ฎ๐Ÿ‡ณ Urgent gaps in India’s engineering education & research ecosystem • ๐ŸŽ“ Skills young engineers & PhD aspirants need for semiconductors + AI + quantum • ๐ŸŒ What excites him most about the next decade of computing and India’s global role ๐ŸŽง A deep, insightful, and future-facing conversation you don’t want to miss! In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape. Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area. Guest : Amlan Chakrabarti Prof. Amlan Chakrabarti is a distinguished academic and researcher with over 20 years of experience in engineering education and research. He serves as the Chief Coordinator of the International Center of Excellence for Data Science, Artificial Intelligence, and Futuristic Technologies—an initiative of the Department of Higher Education, Government of West Bengal—driving innovation, collaboration, and global impact through advanced research and education. A Professor and Director of the A.K. Choudhury School of IT, University of Calcutta, and Adjunct Professor at IIIT Delhi, his core expertise spans quantum computing, machine learning, computer vision, cyber-physical systems, and reconfigurable computing. He completed his Ph.D. in quantum computing at the University of Calcutta and post-doctoral research at Princeton University, and has been recognized with several prestigious honors including the Young Scientist Award, BOYSCAST Fellowship, and Senior Member of IEEE status. Prof. Chakrabarti has authored over 200 research publications and has successfully secured multiple national and international research grants.
Watch the Episode here:





1/14/2026

๐Ÿ’ป๐Ÿง‘‍๐Ÿซ Inside the Fab: Industrial Ingot Preparation Methods

 




This TSW (The Semiconductor Webinar) goes beyond textbook crystal growth theory and focuses on how ingots are actually prepared in semiconductor fabs. We will discuss industrial-scale ingot preparation methods—why certain methods are chosen, what process trade-offs fabs care about, and how quality, yield, cost, and scalability drive real decisions.

The session is industry-oriented, covering practical insights into methods such as CZ, MCZ, FZ, and specialty approaches, with emphasis industry inclined topics, rarely explained in academic courses. Designed for students, fresh graduates, and professionals aiming to work in fabs, this webinar bridges the gap between theory and manufacturing reality, helping you understand how upstream wafer decisions impact downstream device performance and yield. Who should attend: * Aspiring fab engineers & process engineers * VLSI / semiconductor students preparing for industry roles * Professionals transitioning from EDA/design to manufacturing * Anyone who wants a fab-floor perspective, not textbook slides If you want to understand how fabs think, not just how books explain—this session is for you. Guests Bio :
1. Bhavesh Motwani : Bhavesh Motwani is currently being enrolled in the MTech program in Semiconductor Technology at Nirma University. He is being trained as an intern at Monk9 Technology, where hands-on experience in semiconductor fabrication is being gained. His BTech degree in Electronics and Communication Engineering was completed at GEC Bharuch, affiliated with Gujarat Technological University. His initial interest in the field of Electronics and Communication was sparked by work in robotics and embedded systems. Several projects were undertaken using platforms like MSP430, Arduino, and ESP boards. Through this exploration, deeper curiosity about the internal working of these systems was developed, eventually leading him toward the field of VLSI and semiconductors. Due to limited lab access and software tools at his government college, Bhavesh was encouraged by a professor to pursue MTech at a reputed institution. At Nirma University, inspiration was drawn from Dr. N.M. Devashrayee, whose teaching in semiconductor fabrication and physics encouraged him to explore the domain in depth. This interest marked the beginning of his journey into semiconductor fabrication, packaging, assembly, and testing. As India’s semiconductor ecosystem continues to expand, Bhavesh is determined to contribute meaningfully and aspires to take on a leadership role in advancing the industry. Jayshree Adwani : Jayshree Adwani is currently being enrolled in the second year of the MTech program in Semiconductor Technology at Nirma University. She is undergoing internship training at MONK9, with a focus on the semiconductor fabrication domain. Her interest in semiconductors was cultivated during her undergraduate studies in Electronics and Communication Engineering at Charusat University. A six-month internship was completed at VERIFAST Technologies, which later transitioned into a full-time role where she worked for one year in the verification domain. While experience in verification and familiarity with communication protocols was gained, a stronger inclination toward fabrication was gradually developed. The ability to transform theoretical knowledge into physical semiconductor devices inspired her to pursue further studies focused on fabrication. Throughout her MTech program, comprehensive knowledge has been acquired in semiconductor physics, cleanroom processes, and fabrication flow — covering wafer processing, device physics, and IC manufacturing. This hands-on exposure has deepened her passion and expertise in the field. At Nirma University, Jayshree has also been actively involved in facilitating connections between academia and industry. Internship opportunities have been sought independently by her, both during and after her time at VERIFAST. She remains committed to contributing to India’s semiconductor growth and envisions herself playing a key role in this transformative industry. Watch the webinar here :





๐ŸŽ™️Building Semiconductors Beyond Tech Hubs: Bihar ’s Ground Reality | Dr. Bibhuti Bikramaditya

 



What does it really take to build a semiconductor ecosystem in a region often labeled as “non-tech”? ๐Ÿค”

And what changes when global semiconductor experience meets grassroots action in Bihar ๐ŸŒฑ?
In this special episode of The Semiconductor Podcast, we speak with Dr. Bibhuti Bikramaditya, Director of Smartway Electronics Pvt. Ltd. He is a global product & R&D leader in VLSI, embedded systems, nanotechnology, and hardware innovation—who chose to return home and build deep-tech capacity from Patna ๐Ÿ‡ฎ๐Ÿ‡ณ. ๐Ÿ” Inside this conversation: ๐Ÿš€ Building deep-tech initiatives from Eastern India ๐ŸŽ“ Student readiness, awareness gaps & untapped talent ๐Ÿง  Bridging academia–industry gaps in non-tech states ๐Ÿ—️ Real bottlenecks: faculty, curriculum, exposure & infrastructure ๐Ÿงฉ What it takes to create a strong and supportive R&D ๐Ÿงฑ Structural deficiencies in the present academic framework ๐Ÿค How Eastern India can collaborate as a shared ecosystem Episode will be available in Spotify soon! ๐ŸŒ This episode reflects TSP’s evolving mission—from fabs and headlines to foundations and human capital. In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape. Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area. Guest : Dr. Bibhuti Bikramaditya Dr. Bibhuti Bikramaditya is an accomplished Product and R&D leader with over 23 years of experience spanning nanotechnology, VLSI (FPGA/ASIC), embedded systems, and hardware product development. A graduated incubatee of IIT Patna, he is the Director of SmartWay Electronics Pvt. Ltd., having secured funding from IIT Patna, the Department of Industry, Government of Bihar, and the Startup India Seed Fund. His research contributions include nano-electronics and nanomaterials for advanced LED devices, with a provisional patent filed and hands-on expertise across advanced characterization and nanotechnology tools. Beyond industry, Dr. Vikramaditya is the Founder of BiharBrains Development Society, a non-profit focused on building a research and innovation culture in Bihar, and the driving force behind the annual Bihar Science Conference, an international forum hosted with leading universities. He also serves as the Managing Editor of Manthan, an international peer-reviewed journal, reflecting his commitment to advancing scientific research, capacity building, and deep-tech ecosystem development in Eastern India. Watch the podcast episode here :




12/28/2025

๐ŸŽ™️Building Semiconductor Manufacturing in India | Guest - Venkatesh Kumar Pandurengan | TSP

 


What an energising and insightful conversation we had today on The Semiconductor Podcast (TSP) with Venkatesh Kumar Pandurengan ๐Ÿ™ŒGeneral Manager of PTW Semiconductor India Private Limited India Semiconductor India Pvt. Ltd.

A true semiconductor manufacturing expert with 20+ years of hands-on experience across ๐Ÿญ Fabs | ๐Ÿ“ฆ ATMPs | ๐Ÿงช OSATs | ๐Ÿ› ️ OEMs | ๐Ÿ”ง Engineering R&D services.

This episode shines a bright light ๐Ÿ’ก on the manufacturing side of semiconductors — the part that quietly makes everything work, yet doesn’t always get the spotlight it deserves.

๐Ÿ”๐Ÿ’ฌ What we have discussed :

⚙️ Real on-ground challenges of setting up Fabs, ATMPs & OSATs in India

๐Ÿ—️ Why infrastructure, utilities & facility readiness are deal-makers

๐Ÿ› ️ How equipment engineering & process discipline keep fabs stable and reliable

๐Ÿ“œ India’s policy environment — what’s helping today & what can evolve tomorrow

๐ŸŽ“ Importance of manufacturing-focused skills & training for industry readiness

๐Ÿš€ Where MSMEs & startups can plug into the manufacturing ecosystem

๐ŸŒ Why foreign–local partnerships are essential for long-term success

๐Ÿ“š A sneak peek into his upcoming book on semiconductor manufacturing

๐ŸŒฑ Practical advice for students, educators, industry leaders & policymakers

๐Ÿ’ก Whether you’re a student dreaming of fabs, an educator shaping curriculum, a startup founder, or an industry professional, this episode offers grounded, real-world insights into India’s semiconductor manufacturing journey ๐Ÿ‡ฎ๐Ÿ‡ณ✨

In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape. Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area. Guest : Venkatesh Kumar Pandurengan Venkatesh Kumar Pandurengan is a seasoned practice leader with over 20 years of experience in semiconductor equipment engineering, manufacturing operations, and engineering R&D services, spanning fab, ATMP, and OSAT environments. His expertise covers a broad range of semiconductor process and manufacturing domains, including ATMP/OSAT operations, CVD, PVD, ALD, Etch, Metrology, CMP, wafer handling, equipment integration, and quality systems. Venkatesh has worked across leading fab, ATMP/OSAT, and OEM ecosystems with organizations such as HCL Technologies (Sankalp Semiconductors), Tech Mahindra, Infineon Singapore, and ASE Singapore, as well as global fabs including IM Flash Singapore, Micron Singapore, GlobalFoundries, and Semiconductor Laboratory (SCL), Mohali. He brings deep hands-on engagement with major semiconductor equipment OEMs such as Applied Materials, Lam Research, ASML, Tokyo Electron (TEL), KLA, Advantest, and Teradyne, including their sub-assembly and service ecosystems. This breadth of exposure gives him end-to-end insight into the semiconductor manufacturing value chain, from equipment engineering to high-volume manufacturing. With over two decades of industry experience, Venkatesh is recognized as a leader in setting up, sustaining, and scaling semiconductor manufacturing ecosystems in India. He is an active advisor to the Bharat Semiconductor Society, supporting the incubation of emerging startups enabling semiconductor manufacturing in the country. Currently, he serves as General Manager, PTW Semiconductor India Private Limited, part of the PTW Group of Companies, headquartered in Singapore. He is also the author of the upcoming book “Sivakasi to Silicon Valley via Singapore,” scheduled for publication in February 2026.

Watch the Episode here :