4/11/2025

🎙️ PCBs Unplugged: Evolution, Challenges, and Future of Circuit Boards | TSP | Guest Petr Dvorak



In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape.

Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area. 🎤 Introduction : The guest (Petr Dvorak) introduced himself, sharing his journey and career highlights in the PCB industry. 📈 PCB Evolution : Discussed major advancements in PCB technology over the last two decades. ⚙️ PCB Production Process : Walkthrough of the PCB manufacturing process and tools used. 🔄 Transition to SMDs : Explored when and why the shift from bulky components to Surface Mount Devices (SMDs) happened. 🧩 Future of Bulky Components : Debated whether large components are becoming obsolete or will remain relevant. 🔌 Changes in AC Adaptors : Discussed whether traditional step-down transformers are being phased out and what is replacing them. ✅ Quality Assurance : Covered how manufacturers ensure PCBs meet quality and performance standards. 🔬 Pre-Solder Testing : Reviewed the testing processes that happen before components are soldered onto PCBs. 🔥 Heat Tolerance : Examined how PCBs handle heat during production and in practical use. 🌡️ Thermal Issues : Discussed common thermal challenges and the solutions used to address them. 🤖 PCB Design Process : Explored whether PCB layout is done manually or through automation, and how this has evolved. 📚 Highlighted the complexities of manufacturing multi-layer PCBs and the challenges faced in the process. Guest : Petr Dvorak
An experienced electronics engineer with a deep-seated passion for open-source hardware and a fervent belief in the power of KiCAD. Excels in the entire hardware design process, from concept to prototype to manufacturing, utilizing KiCAD as the primary tool for creating electronic designs. The journey into electronics unfolds gradually, fueled by a deep-seated passion for creating. Formal education commences in a technical high school and culminates at the Czech Technical University in Prague. Proficient in digital electronics, with a strong foundation in mixed-signal systems and a moderate level of knowledge in analog electronics. Fulfillment comes from projects that deliver tangible results and contribute to the advancement of technology. Believes that even the most modest projects can hold immense value, providing valuable learning experiences and opportunities to showcase skills. Contact Petr Dvorak: LinkedIn Profile : https://www.linkedin.com/in/petr-dvorak-hw/ Training/Course Link : https://www.fedevel.com/instructors/petr-dvorak


Watch the podcast here :






Image by Lucas Wendt from Pixabay

4/09/2025

An Open Invitation for The semiconductor Podcast (TSP)

 


🎙️ TSP – Invitation & Format Overview :

We've been running The Semiconductor Podcast (TSP) for a while now—a platform where passionate individuals across domains like VLSI, Embedded Systems, AI, PCB Design, Router Networking, and Consumer Electronics come together to share their experiences. Essentially, if there’s a semiconductor chip operating at the core of your work, this podcast is for you. 💡
Our goal is to provide a voice to the many unsung heroes in the semiconductor ecosystem. Guests often share their professional journeys, along with insights into their area of expertise. Every conversation is authentic and centred around real experiences. 🛠️💬


Why We Might Not Be Seeing You
Social media algorithms work in unpredictable ways. 📉 Even when we're connected, we often miss out on seeing the amazing posts and contributions from many in our network—especially when it comes to technical content.
So, if you’re reading this and would like to be part of the podcast, don’t hesitate to reach out—we’d love to hear from you! 🙌


🚫 Why You Might Not Be Seeing Our Posts
Social media algorithms can be strange. 🌀 Even those connected with us sometimes miss our updates. The distribution is inconsistent, especially with tech-heavy content.
So, if you’re seeing this message and feel interested in participating in the podcast, don’t hesitate—reach out! 🎧


📩 To apply: 

Please email us at: 📬 business@techsimplifiedtv.in


🛑 Important Email Policy:


We do not accept requests sent from public email services (Gmail, Yahoo, MSN, etc.). Please use an official email associated with your company, university, or organisation. ✅


🎓 Exception for Students: You’re welcome too! Just send your request through your college/university professor’s or faculty member’s official email, bearing the institution's domain.


🧩 TSP Format Myth Busters & Key Points 


Completely Free – No fee to participate in the podcast.
🌍 Fully Virtual – Join from anywhere in the world.
🎥 No Edits – Conversations are uploaded to YouTube as-is.
🤝 Confidentiality Respected – We stick to general questions to protect sensitive info.
📋 Prepared in Advance – Topics/questions shared 7 days before the live event.
🎯 Flexible Content – Skip or add questions as needed—just let us know in advance.
We're excited to continue showcasing voices from the semiconductor community.
If you have a story, experience, or insight to share—TSP is your platform.


Let’s connect! 💬✨


Courtesy : Image by www.pngegg.com









4/07/2025

🎙️ Silicon, Stories & Self-Reliance: The Monk9 Tech Journey| TSP | Guest - Marmik Bhatt




In this inspiring episode of The Semiconductor Podcast, host Munmun Dey sits down with Marmik Bhatt the passionate and driven startup founder from Gujarat, leading Monk9 Tech Private Limited with vision and determination to unpack a journey powered by purpose, innovation, and resilience. Starting his journey in computer applications, he eventually found his calling in the world of ASIC. His collaboration with efabless played a pivotal role in shaping his path toward founding Monk9Tech. A highly disciplined learner, Marmik has spent the past two and a half years immersing himself in over 1,000 research papers. Today, he and his team are building a business focused on legacy nodes, while also mentoring students and newcomers stepping into the ASIC domain. Amidst all this, he continues to pursue research, exploring innovative methodologies for advanced node technologies. 🌟 🧘‍♂️ Discover the origin story behind the name Monk9 Tech, and how early experiences with Efabless helped shape a bold mission in custom chip design. From tackling real-world challenges to pioneering a 130nm open-source PDK, this conversation dives deep into the future of RISC-V, neuromorphic computing and even 30Å angstrom-scale technologies named after India's National Hero Netaji Subhash Chandra Bose*. 🇮🇳 💡 We also explore Monk9’s unique approach to collaborative research, lab facilities, fab resource sharing, and how India can chart its path toward semiconductor self-reliance. If you’re curious about the future of silicon in India and the role of startups in driving that vision forward—this episode is a must-listen! 🎧 🔬 Topics Covered: - The founding story of Monk9 Tech & its unique name 🧘‍♂️🐶 - Experience with Efabless & open-source chip design 💻 - Custom microchips & 130nm PDK for researchers 🔧 - RISC-V processors in AI & scientific computing 🤖 - Neuromorphic chips & brain-inspired innovation 🧠 - India’s future in semiconductor manufacturing 🇮🇳 - Collaborations, compound semiconductors & 5G/6G chips 📡 - Vision, challenges & solutions for Indian startups 🚀 In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape. Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area. Guest : Marmik Bhatt Marmik Bhatt is Tech Enthusiastic and problem solver with vision to make things simple with technology, worked in corporate for 15 years making amazing teams and products during job now engaged in making India’s own TSMC.


Watch the podcast here :


Image by Lucas Wendt from Pixabay




🎙️ The eSim Journey, Revolution & The Future of Open-Source EDA | TSP | Guest - Sumanto Kar

 




🎯 In this episode We dive into the decade-long journey of eSim, the powerful open-source EDA tool created under the supervision of IIT Prof. Kannan Moudgalya. 🌟 From its humble beginnings to its current capabilities in analog, digital, and mixed-mode simulations, eSim has evolved into a robust solution used in hackathons and engineering projects. 💡

🔍 Key Insights You'll Discover: ✅ The Power of Open-Source: How Linux’s vision sparked a movement, influencing FOSS adoption in engineering. 💻 ✅ Challenges & Sustainability: Can open-source EDA tools survive in a world dominated by proprietary giants? 🛠️ ✅ AI & Open-Source: The role of AI and ML in boosting the performance and relevance of open-source design tools. 🤖 ✅ Open Hardware & IC Design: Can FOSS tools drive a revolution in collaborative, community-driven semiconductor design? ⚙️ ✅ Academia & Industry Collaboration: How open-source EDA tools like eSim are transforming engineering education and preparing students for real-world challenges. 🎓 🌐 Why Watch This? - Learn how open-source mixed-signal simulation tools can reshape IC design workflows. - Discover how governments, universities, and large semiconductor companies can support and adopt FOSS-based engineering tools. - Get insights into the future of open-source licensing amid rising AI-powered design automation. 🔥 Useful Links for Students/Professionals/Educators : eSim Homepage: https://esim.fossee.in/ FOSSEE Hompage: https://fossee.in/ FOSSEE Internships page: https://fossee.in/fossee-internships Spoken Tutorial Homepage: https://spoken-tutorial.org/ eSim Spoken Tutorial Page: https://spoken-tutorial.org/tutorial-search/?search_foss=eSim&search_language=English eSim GitHub Repositories: https://github.com/FOSSEE/eSim https://github.com/FOSSEE/nghdl eSim Other Resources for Practice & Education : https://esim.fossee.in/resources Cloud Versions of eSim and Arduino on Cloud: https://simulation.iitbx.in/ https://github.com/frg-fossee/eSim-Cloud 🧠 Whether you're an electronics engineer, researcher, or student, this episode offers valuable insights into the future of FOSS in semiconductor design. Don't miss it! 🚀💥 In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape. Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area. Guest : Sumanto Kar


Sumanto Kar is an Assistant Project Manager at FOSSEE, IIT Bombay, where he has played a key role in the development and promotion of eSim, an open-source EDA tool for circuit design and simulation. He has been actively involved in large-scale training programs, intern management, and technical projects focusing on simulation, PCB design, and optimization. Currently he is pursuing an M. Tech. in Industrial Engineering and Operations Research at IIT Bombay. He holds a B.E. in Electronics Engineering from Mumbai University and is actively engaged in open-source development, technical mentorship, and community-building initiatives with an aim to "Empower youth in Semiconductor technology".

Watch the TSP Episode here :
Credits : Image by Lucas Wendt from Pixabay






What is detailed Routing in VLSI Physical Design?

 



In this article, we have explored the concept of detailed routing in VLSI Physical Design, an essential step in the overall design flow that ensures efficient signal connectivity while optimizing chip area and performance. We begin by discussing the various routing techniques used in modern VLSI design, along with the significance of horizontal and vertical constraints in determining routing feasibility. The video further delves into zone representation and the Horizontal & Vertical Constraint Graph, which are crucial for structuring the routing process systematically. Additionally, we cover different routing methodologies, including channel routing techniques such as the Left Edge Algorithm and Dogleg Routing, as well as switchbox routing and Over-The-Cell (OTC) routing, explaining both the algorithm and methodology behind OTC routing. Finally, we address the modern challenges faced in detailed routing, highlighting the complexities and evolving strategies required to meet the demands of advanced semiconductor technologies.


Design Flow and Detailed Routing:




In VLSI , routing is a crucial step that connects the various components on a chip. It involves determining the paths for electrical connections, which are implemented through metal layers on the chip. Routing is divided into three major stages:

(i) Global, (ii) Detailed & (iii) Specialized Routing.

The layout region is represented during global routing using a coarse grid of global routing cells (gcells) or more general routing regions (channels, switchboxes). After global routing, each net undergoes detailed routing. Objective of detailed routing: Assign route segments of signal nets to specific routing tracks, vias, and metal layers while following global routes and design rules.

Key advantage:

(a) Detailed routing of one gcell can be performed independently as long as routes remain connected across neighboring gcells.

(b) This enables an efficient divide-and-conquer strategy and supports parallel algorithms, allowing detailed routing runtime to theoretically scale linearly with layout size.

(c) Traditional detailed routing occurs within routing regions such as channels and switch boxes. Modern designs use over-the-cell (OTC) routing , allowing routing over standard cells.

Due to technology scaling, modern detailed routers must consider manufacturing rules and the impact of manufacturing faults.


Different Routing Techniques :




i. Channel Routing :
Type of detailed routing where connections between terminal pins are routed within a channel with no obstacles. Pins are located on opposite sides of the channel .Conventionally, the channel is oriented horizontally, with pins on the top and bottom. In row-based layouts, routing channels typically have uniform width. In gate-array and standard-cell circuits with more than three metal layers, channel height (number of routing tracks) is also uniform.

ii .Switchbox Routing : Used when pin locations are on all four sides of a fixed-size routing region. More complex than channel routing due to additional constraints. OTC (Over-The-Cell) Routing : Utilizes additional metal tracks (e.g., Metal3, Metal4) that are not obstructed by cells. Allows routes to cross over cells and channels. Only metal layers and tracks not occupied by cells can be used. When cells use only polysilicon and Metal1, routing can be performed on Metal2, Metal3, etc., and unused Metal1 resources.

iii. Classical Channel Routing : Routing area is a rectangular grid with pin locations on top and bottom boundaries. Pins are placed on vertical grid lines or columns. Channel height depends on the number of tracks needed to route all nets. In two-layer routing, one layer is reserved for horizontal tracks while other layer is reserved for vertical tracks. Preferred routing direction is determined by floorplan and standard-cell row orientation. 


Horizontal & Vertical Constraint:


1. Horizontal Constraint : 

A horizontal constraint between two nets occurs when their horizontal segments overlap while being placed on the same track. In the example shown includes one horizontal and one vertical routing layer, nets B and C are horizontally constrained. If the horizontal segments of two nets do not overlap, they can be assigned to the same track without constraints for instance, nets A and B.


2. Vertical Constraint :

 


A vertical constraint between two nets  occurs when they have pins in the same column. This means that the vertical segment extending from the top must stop within a short distance to avoid overlapping with the vertical segment coming from the bottom in the same column. If each net is assigned to a single horizontal track, the horizontal segment of a net from the top must be placed above that of a net from the bottom in the same column. In Fig. , this constraint ensures that net A’s horizontal segment is placed above net B’s. To resolve these constraints, at least three columns are needed to separate the two nets. While a vertical constraint implies a horizontal constraint, the reverse is not always true. However, both constraints must be considered when assigning segments within a channel.



Zone Representation :



In a channel, each horizontal wire segment must extend at least from the leftmost to the rightmost pin of its net. Let S(col) represent the set of nets passing through column col. This includes nets that either (1) have a pin in col or (2) connect to pins on both sides of col. Since horizontal segments cannot overlap, each net in S(col) must be assigned a separate track within that column. However, not all columns are necessary to define the entire channel. If a column i has a net set S(i) that is a subset of another column j (i.e., S(i) ⊆ S(j)), then S(i) can be ignored as it imposes fewer constraints on routing. In the above fig , every S(col) is a subset of at least one of S(c), S(f), S(g), or S(i). These columns (c,f, g, and i) form the minimal set needed, as they collectively include all nets. The relative positions of nets in a channel routing instance, defined by horizontal and vertical constraints, can be represented using horizontal and vertical constraint graphs.  These graphs help to: (1) estimate the minimum number of tracks needed , (2) identify potential routing conflicts.


Horizontal & Vertical Constraint Graph:

1. Horizontal Constraint Graph : 


 

A graphical representation can be used to depict the nets within a channel. This can be done using a Horizontal Constraint Graph (HCG), where: nodes (V) represent the nets in the netlist. Edges (E) exist between two nodes if their corresponding nets belong to the same set S(col), meaning they are horizontally constrained.

Fig. (iv) shows the HCG for the channel routing example in Fig.(iii). The minimum number of tracks required for channel routing can be determined using either the HCG or the zone representation. This minimum is given by the largest S(col) set. 


2. Vertical Constraint Graph : 


Vertical Constraint Graph (VCG) represents vertical constraints in channel routing,  nodes (V) represent nets , directed edges (E) exist between nodes if one net must be placed above another. In Fig. (v), some edges (like B → C) are omitted if they can be inferred from other 
                                      edges (e.g., B → E ).


A cycle in the VCG indicates a conflict where two nets overlap in a column, meaning their horizontal segments would need to be both above and below each other—an impossible situation. This is resolved by splitting the net and adding an extra track . fig(vi).


Channel Routing Algorithms :

Channel routing aims to minimize the number of tracks needed for routing. In gate-array designs, where channel height is usually fixed, algorithms are developed to ensure complete (100%) routing.




1. Left-Edge Algorithm: An early channel routing algorithm was developed by Hashimoto and Stevens. Their simple and widely used left-edge heuristic, based on the VCG and zone representation, efficiently maximizes track usage. The VCG determines the order in which nets are assigned to tracks,
while the zone representation decides which nets can share the same track. Each net uses only one horizontal segment (trunk).

 The left-edge algorithm works as follows:
1. Start with the topmost track.
2. For all unassigned nets, generate the VCG and zone representation.
3. Process nets from left to right, assigning each to the current track if:
- It has no predecessors in the VCG.
- It does not conflict with previously assigned nets.
4. Once a net is assigned, remove it from the unassigned list.
5. Move to the next track and repeat the process until all nets are assigned.


This algorithm finds a solution with the minimum number of tracks if the VCG has no cycles. Yoshimura later improved track selection by considering net length in the VCG, and Yoshimura and Kuh further optimized track usage by splitting nets before constructing the VCG.


Dogleg Routing :






To handle cycles in the VCG, an L-shaped "dogleg" can be used. Doglegs help resolve conflicts in VCGs and reduce the total number of tracks. Dogleg algorithm, developed in the 1970s, eliminates cycles and minimizes routing tracks by extending the left-edge algorithm.




 It splits p-pin nets (p > 2) into p – 1 horizontal segments, but only in columns where the net has a pin, assuming no extra vertical tracks are available. After splitting, the algorithm follows the left-edge approach, with subnets represented in the VCG and zone representation.

Switchbox Routing :






Switchbox routing algorithms are often derived from channel routing techniques. Luk extended a greedy channel router by Rivest and Fiduccia to develop a switchbox routing algorithm with key improvements:
1. Pin assignments are made on all four sides.
2. A horizontal track is assigned automatically to a pin on the left.
3. Jogs are used for top and bottom pins and for horizontal tracks connected to the rightmost pins.
While this algorithm performs similarly to the greedy channel router, it does not guarantee full routability due to fixed switchbox dimensions.

Ousterhout et al. introduced a channel and switchbox router that considers obstacles like pre-routed nets . Cohoon and Heck developed BEAVER , which optimizes routing area and via usage. BEAVER offers flexibility in layer routing and
employs four strategies:
1. Corner-routing – uses horizontal and vertical segments forming bends.
2. Line-sweep routing – handles simple connections and straight segments.
3. Thread-routing – supports various connection types.
4. Layer assignment – optimizes layer usage.
BEAVER surpasses previous academic routers in routing area and via efficiency.
Another notable switchbox router, PACKER, developed by Gerez and Herrmann in
1989 follows three main steps:
1. Routing each net independently without considering capacity constraints.
2. Resolving conflicts using connectivity-preserving local transformations (CPLT).
3. Modifying net segments locally to reduce congestion.


Over-the-Cell (OTC) Routing Algorithms :




Most routing algorithms focus on two-layer routing. However, modern standard-cell designs use multiple layers, requiring
extensions to these algorithms. One common approach places cells back-to- back or without routing channels. Internal
routing primarily uses Poly and Metal1, while higher metal layers (e.g., Metal2 and Metal3) remain unobstructed and are used for over-the- cell (OTC) routing. These layers are
represented by a coarse routing grid of gcells. Nets are first globally routed as Steiner trees and then detail-routed.

Another approach introduces channels between cells, but routing within them is limited to internal layers like Poly and Metal1. Higher metal layers (Metal2, Metal3) handle most routing, making traditional routing channels unnecessary. Instead, routing occurs across the entire chip  rather than in defined channels or switchboxes . 

OTC routing often coexists with channel routing. For example, IP blocks may block routing on lower metal layers, forming channels or switchboxes between them. FPGA fabrics use fewer metal layers to reduce costs, clustering interconnects into channels. FPGAs also include pre-designed components like multipliers and DSP blocks that rely on OTC routing. Modern FPGAs feature express-wires on higher metal layers that cross logic elements.



Modern Challenges in Detailed Routing :

1. Technology Scaling & Wire Widths:
Demand for low-cost, high-performance, and low-power ICs has driven technologyscaling since the 1960s. Different metal layers use wires of varying widths, with wider wires on higher layers improving signal speed but reducing routing tracks. Thicker wires are commonly used for clock, power supply, and global interconnects.

2. Routing Complexity & Layer Configurations:
Modern ICs use different metal layer configurations to optimize performance. Vias connecting wires of different widths block routing resources on layers with smaller pitches.
.
3. Manufacturing Yield & Detailed Routing: 
Yield concerns require via doubling and non-tree routing for redundancy. At advanced nodes, design rules become restrictive, specifying minimum spacing between wires and vias based on width and corner proximity. Forbidden pitch rules prohibit certain wire spacings while allowing others.

4. Via Defects & Mitigation: 
Vias connect wires between metal layers but may misalign or degrade due to electromigration. Partial via failure increases resistance, leading to timing violations; complete failure disconnects nets. Double vias improve reliability but require additional area and adherence to design rules. Congested areas may limit via doubling options.

5. Interconnect Defects & Redundancy Measures:
Shorts & Opens: Shorts (unintended wire connections) are mitigated by increased spacing, though excessive spacing
raises wire length. Opens (broken connections) are addressed via non-tree routing and redundant wiring, which improves
reliability but increases short risks.

6.  Antenna-Induced Defects: 
Excessive charge buildup during plasma etching can damage transistor gates. Mitigation involves controlling metal-to-gate area ratios and rerouting via new or relocated vias.

7. Manufacturability-Aware Routing:
Yield-optimized detailed routing is proposed, but its benefits are hard to quantify pre- manufacturing, limiting industry adoption.







Watch the video lecture here:







Courtesy : Image by www.pngegg.com








3/05/2025

🎙️From Physics to Foundership : Building a Business with Science 🔬| TSP | Guest - Dr. Meri Helle




In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape.

Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area. "From Research to Entrepreneurship" perfectly sums up today’s guest, Dr. Meri Helle’s journey! ⚡🔬 A passionate technologist and physics enthusiast, she blends scientific curiosity with business acumen, successfully commercializing products from small to medium-scale fabrication units. With rare experience in running a thriving wafer processing business alongside a team of like-minded technical experts, her path has been anything but ordinary. But it wasn’t always smooth sailing! 🌊 She once had to forgo a postdoctoral opportunity at a prestigious university. Yet, she embraced family life and motherhood with unwavering determination and her ever-optimistic spirit. 👩‍👧✨ Dr. Helle finds opportunities in every challenge and gracefully normalizes tough situations with her signature phrase: "It is what it is." 😊 A truly inspiring and joyful person to talk to—her energy is contagious! 🚀💡 Every entrepreneur has a unique story, and in this podcast, we uncover the fascinating journeys of trailblazers in VLSI, semiconductor fabrication, and photonics. 🌍✨ Join us as we explore: 🔬 The transition from research to entrepreneurship—what drives innovators to take the leap? 💡 The challenges faced, including gender bias, funding struggles, and the professional journey in wafer preparation. ⚡ The journey of turning research into production—bridging academia and industry. 📈 Emerging trends like More-than-Moore, and AI’s impact on fabrication. 🛠️ How semiconductor professionals can upskill for the future of AI-driven manufacturing. 🌍 Global collaboration—insights into the Nordic semiconductor landscape and Europe’s new policies. 🌿 The importance of sabbaticals and personal growth beyond work. Whether you're a VLSI enthusiast, an aspiring entrepreneur, or just curious about the future of semiconductor tech, this podcast delivers insights, inspiration, and expert advice. 🎧💭 Stay tuned for deep dives into the world of chips, circuits, and cutting-edge innovation! 🔍🚀

Watch the podcast here.

Guest : Dr. Meri Helle Dr. Meri Helle has been a semiconductor entrepreneur since 2015. Summa Semiconductor, founded in 2015, was pioneering in small-scale manufacturing services utilising a shared, open-access cleanroom in Finland. A joint-venture company, OneFab Finland, prepared a €100 million fab investment plan in 2019. Third company, OneFab Nordic Oy, was registered in January 2025. With a group of ten founding partners, OneFab is going to have a significant impact on semiconductor manufacturing restructuring in the coming years. Dr. Helle holds a doctoral degree from Helsinki University of Technology in quantum physics (2006). Before moving to industry, she was working with superconducting nano-electronics as a postdoc in Low Temperature Laboratory, Aalto University, Finland (2007-2010). Dr. Helle joined Nokia Research Centre 2010 and 2011 silicon wafer manufacturing company Okmetic. After completing the first year at Okmetic as a Process Engineer, Dr. Helle moved to Okmetic’c sales team as a Customer Support Engineer. Her main responsibilities were in Taiwan, Singapore, Malaysia as well as supportive role in Europe and the USA.
Credits : Image by Lucas Wendt from Pixabay



3/04/2025

🎙️ Penang’s Semiconductor Boom: Evolution, Impact & Future with ET Tan 🌏💡 | TSP



In this insightful episode of The Semiconductor Podcast (TSP), we sit down with industry veteran ET Tan to explore the incredible 30-year evolution of the semiconductor industry in Penang 🏭💡. From the early economic shifts 💰 to the initial reactions of job seekers 👨‍🎓➡️👨‍🏭, we dive deep into how skill development 🛠️ and university involvement 🎓 have shaped Malaysia’s tech ecosystem.

We also discuss whether Penang is outsourcing its workload 🌍, how semiconductors have fueled Malaysia’s economy post-independence 🇲🇾, and the key factors that will define the next decade of the global semiconductor industry 🚀📡.

Wrapping up, ET Tan shares invaluable career advice for young engineers 🔧📖—how to stay technically relevant and future-proof in this ever-evolving field. 📢 Don’t miss this power-packed discussion on one of Asia’s most dynamic semiconductor hubs! Tune in now! 🎧✨ 🔹 Key Discussion Points: 📈 The evolution of Penang’s semiconductor industry over the last three decades. 💰 The economic shifts in Malaysia when the semiconductor industry began. 👨‍💼 The initial reaction of job seekers to semiconductor opportunities. 🛠️ Advancements in skill development for semiconductor professionals. 🎓 The increasing role of universities in shaping the semiconductor ecosystem. 🌍 The trend of outsourcing semiconductor workload from Penang to other regions. 🇲🇾 The semiconductor industry's contribution to Malaysia’s economy post-independence. 🚀 Key factors that will drive the global semiconductor industry over the next 10 years. 🔧 Expert career advice for young engineers on staying technically relevant and future-ready. 🎧 Tune in now to gain expert insights into Penang’s semiconductor journey and its future! 🚀 In this podcast series, discussion on VLSI and its related fields is presented, focusing on recent developments and advancements in the industry. Topics such as the latest trends and innovations in semiconductor technology are explored, offering insights into the evolving landscape. Career guidance is shared, providing practical advice for navigating the field, along with success stories that highlight the journeys of professionals who have made their mark in VLSI. Whether for students, professionals, or those interested in the subject, valuable knowledge is offered to help stay informed and succeed in this dynamic area.

Watch the podcast here. Guest : ET Tan ET Tan is a technology veteran with over 35 years of experience in innovation and commercialization. He began his career in Silicon Valley and Silicon Glen, working with HP and Seagate on product development and market-entry strategies for leading-edge technologies. Returning to Malaysia, he served in leadership roles including VP of Strategic Management at Silterra, CEO of Penang Skills Development Centre (PSDC), and Board Member of MIMOS, Malaysia's applied research and development centre. Now, as MD of ET Partners, he helps organizations build technology roadmaps that capitalise on opportunities in chip design, advanced packaging, and manufacturing. With an BSc(Hon) from Imperial College London and an executive MBA from Cranfield, Mr. Tan brings deep technical and strategic expertise to discussions on how companies in Asia can unlock their semiconductor potential in the race to a $1 trillion industry by 2030. Credits : Image by Lucas Wendt from Pixabay